Tuesday Bytes: DISH, T-Mobile, Internap, AMS-IX

As a Nor’easter hits my area, I’ll be hunkered down and hoping the power holds out.  In the meantime, here’s a quick rundown on some news from early this week.

DISH may be looking to make another move toward its dream of a stake in the wireless business. The satellite operator has sold $1B in debt, saying they plan to use the proceeds for ‘strategic transactions’ including ‘wireless and spectrum-related transactions’ or the catch-all of general corporate purposes. The notes are due 2024, pay 2.375% interest, and are convertible at $82.22 per share.  Just what DISH will do or not do in the wireless space has been an ongoing source of speculation for many years.

Also making a move in the debt markets this week is T-Mobile USA. The wireless carrier said this morning it has agreed to sell $1.5B in debt spread evenly across three types of senior notes due 2022, 2025, and 2027. Meanwhile, they are also placing $2.5B with the company’s parent, Deutsche Telekom AG. The net proceeds of $4B will go toward refinancing existing debt.

Internap has a new tenant out on the west coast. The IaaS provider Enzu has signed on in a multi-year colo deal out in Internap’s Los Angeles factility. Enzu has four nodes in LA to go with two up in Silicon Valley as part of its global footprint.

And AMS-IX is in the midst of a core upgrade of its Amsterdam network. In a blog post yesterday, the IX detailed their first implemenentation of a Brocade SLX 9850 switch, moving up from the MLX series. The first rollout was in their euNetworks data center, which will be followed by similar procedures at Equinix and Global Switch.

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Categories: Datacenter · Financials · Interconnection · Telecom Equipment · Wireless